Printing Process and Materials The inkjet-printing process was performed with a Dimatix Materials Printer (DMP) 2831 and an installed piezoelectric printhead with 16 nozzles, which have a distance of 254 μm (Figure 2). The piezoelectric elements are driven by a voltage waveform. A silver nano-particle ink PE410 was used and printed on a PET substrate Melinex 506 (Teijin Films) which has a thickness of 100 μm. The solid content of the ink is 45.2 wt% dissolved in Butyldiglycol and octylamine [11]. The PET substrate consists of an adhesion promoting pre-treatment 印刷工藝與材料 噴墨打印過程是用迪馬提克斯材料打印機完成的。(DMP)2831和一個安裝有16個噴嘴的壓電打印頭,其距離為254μm(圖2)。壓電元件由電壓波形驅動。采用銀納米粒子油墨PE410,在厚度為100μm的PET基板Melinex 506(Teijin薄膜)上印刷。油墨的固含量為45.2%(重量%),溶解在丁基二甘醇和辛胺中。[11]。PET基材包括促進附著力的預處理
Metallic Nanoparticle Inks for 3D Printing of Electronics
The three‐dimensional (3D) printed electronics additive manufacturing industry sector has grown substantially in the past few years, and there is increasing demand for different types of metallic nanoparticle inks in electronics printing for various applications. Metallic nanoparticle inks are commonly used for fabricating conductive tracks and patterns due to their relatively high electrical conductivity as compared to other types of inks, and they can be further categorized into single‐element metallic nanoparticle inks, alloy metallic nanoparticle inks, metallic oxide nanoparticle inks, and core–shell bimetallic nanoparticle (BNP) inks. It is critical to gain a deep understanding of the metallic nanoparticle inks used in 3D printed electronics as the material properties of these inks can directly affect the final electrical and mechanical properties of the printed patterns. This review presents an overview of the available metallic nanoparticle inks used for 3D printing of electronics, and critically reviews the strengths and weaknesses of each type of ink. Finally, the challenges of metallic nanoparticle inks in 3D printed electronics are also discussed along with the future outlook for 3D printed electronics.